Heatsink BGA 23 x 23 x 18 with Pad-
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Description
Product Overview
– Tape mounting saves board space by eliminating mounting holes
– Convenient peel and stick assembly is quick and clean
– Pin-Fin array allows omni-directional airflow to maximize heat dissipation
– Fin dimensions (LxW): 6x6mm
- Fin dimensions (LxW): 6x6mm
- Thermal Resistance: 23.4C/W
- Packages Cooled: BGA
- External Width – Metric: 23mm
- External Height – Metric: 18mm
- Heat Sink Material: Aluminium
- External Width – Imperial: 0.91″
- External Height – Imperial: 0.71″
- Manufacturer: BOYD
- Manufacturer Part No: 374124B00032G
- Order Code: SC10764
- Product Range View the full series and range associated to this part:
- Technical Datasheet: 374124B00032G Â Datasheet
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Specification
Overview
Dimensions | 0.24 × 0.24 cm |
---|---|
Brand |
BOYD |
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