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Heatsink BGA 27 x 27 x 18 with Pad-
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Description
Product Overview
– Tape mounting saves board space by eliminating mounting holes
– Convenient peel and stick assembly is quick and clean
– Pin-Fin array allows omni-directional airflow to maximize heat dissipation
– Fin dimensions (LxW): 8x8mm
- Fin dimensions (LxW): 8x8mm
- Thermal Resistance: 20.3C/W
- Packages Cooled: BGA
- External Width – Metric: 27mm
- External Height – Metric: 18mm
- Heat Sink Material: Aluminium
- External Width – Imperial: 1.06″
- External Height – Imperial: 0.71″
- Manufacturer: BOYD
- Manufacturer Part No: 374424B00035G
- Order Code: SC10769
- Technical Datasheet: 374424B00035G Â Datasheet
Specification
Overview
| Dimensions | 0.31 × 0.31 cm |
|---|---|
| Brand |
BOYD |
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